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dc.contributor.authorChang, YHen_US
dc.contributor.authorWang, LSen_US
dc.contributor.authorChiu, HTen_US
dc.contributor.authorLee, CYen_US
dc.date.accessioned2014-12-08T15:41:35Z-
dc.date.available2014-12-08T15:41:35Z-
dc.date.issued2003en_US
dc.identifier.issn0008-6223en_US
dc.identifier.urihttp://hdl.handle.net/11536/28267-
dc.identifier.urihttp://dx.doi.org/10.1016/S0008-6223(03)00022-8en_US
dc.description.abstractAmorphous carbon films, characterized by XRD, AFM, SEM and Raman, were deposited from SiCl3CCl3 on quartz substrates at 773-1273 K by low pressure chemical vapor deposition using a hot-wall reactor. XPS studies showed that the films brown at 773 K contained 90% C and 10% Cl, while the films grown at 1273 K contained 100% C. SiCl4, CCl4 and Cl2C=CCl2 were detected by on-line FT-IR studies. The extrusion of dichlorocarbene, :CCl2, from SiCl3CCl3 should provide the source of carbon in the reaction. On Si substrates, an etching process at the film-substrate interface assisted the lift-off of the films from the substrates. The C films curled and formed rolls. (C) 2003 Elsevier Science Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectcarbon filmsen_US
dc.subjectchemical vapor depositionen_US
dc.titleSiCl3CCl3 as a novel precursor for chemical vapor deposition of amorphous carbon filmsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/S0008-6223(03)00022-8en_US
dc.identifier.journalCARBONen_US
dc.citation.volume41en_US
dc.citation.issue6en_US
dc.citation.spage1169en_US
dc.citation.epage1174en_US
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:000182959300007-
dc.citation.woscount6-
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