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dc.contributor.authorChang, TYen_US
dc.contributor.authorLee, JWen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorLee, CLen_US
dc.contributor.authorWen, HCen_US
dc.date.accessioned2014-12-08T15:41:37Z-
dc.date.available2014-12-08T15:41:37Z-
dc.date.issued2003-01-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1527052en_US
dc.identifier.urihttp://hdl.handle.net/11536/28294-
dc.description.abstractThin tunneling oxides grown on a CF4 pretreated silicon substrate were prepared and investigated for the first time. The tunneling current of the CF4-treated oxide is about three orders of magnitude higher than that of thermal oxide; furthermore, the stress-induced anomalous current and low electric field leakage current were greatly suppressed. The improvement was attributed to the incorporation of fluorine in the oxide region. Both control and CF4-treated devices exhibited comparable channel mobility. However, pretreatment with CF4 markedly improved the reliability of the insulator. This oxide is highly promising for fabricating low-voltage electrically erasable and programmable read-only memories (EEPROMs) without increasing the complexity of the process. (C) 2002 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleGrowing high-performance tunneling oxide by CF4 plasma pretreatmenten_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1527052en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume150en_US
dc.citation.issue1en_US
dc.citation.spageG33en_US
dc.citation.epageG38en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000180069000055-
dc.citation.woscount1-
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