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dc.contributor.authorChang, SCen_US
dc.contributor.authorShieh, JMen_US
dc.contributor.authorDai, BTen_US
dc.contributor.authorFeng, MSen_US
dc.date.accessioned2014-12-08T15:41:47Z-
dc.date.available2014-12-08T15:41:47Z-
dc.date.issued2002-11-01en_US
dc.identifier.issn1071-1023en_US
dc.identifier.urihttp://dx.doi.org/10.1116/1.1518974en_US
dc.identifier.urihttp://hdl.handle.net/11536/28416-
dc.description.abstractThe influence of current density, duty cycle, and frequency of the applied pulse current on film qualities of electroplated copper was discussed. With various filled damascene structures, the corresponding filling power was optimized in a range of pulse current frequency. The optimized pulse current plating in conjunction with a leveler-free electrolyte resulted in a defect-free filling in approximate 100 nm damascenes and reduced the resistivity of Cu deposits. (C) 2002 American Vacuum Society.en_US
dc.language.isoen_USen_US
dc.titleInvestigations of pulse current electrodeposition for damascene copper metalsen_US
dc.typeArticleen_US
dc.identifier.doi10.1116/1.1518974en_US
dc.identifier.journalJOURNAL OF VACUUM SCIENCE & TECHNOLOGY Ben_US
dc.citation.volume20en_US
dc.citation.issue6en_US
dc.citation.spage2295en_US
dc.citation.epage2298en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000180307300022-
dc.citation.woscount12-
Appears in Collections:Articles


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