Investigations of pulse current electrodeposition for damascene copper metals

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DC 欄位	值	語言
dc.contributor.author	Chang, SC	en_US
dc.contributor.author	Shieh, JM	en_US
dc.contributor.author	Dai, BT	en_US
dc.contributor.author	Feng, MS	en_US
dc.date.accessioned	2014-12-08T15:41:47Z	-
dc.date.available	2014-12-08T15:41:47Z	-
dc.date.issued	2002-11-01	en_US
dc.identifier.issn	1071-1023	en_US
dc.identifier.uri	http://dx.doi.org/10.1116/1.1518974	en_US
dc.identifier.uri	http://hdl.handle.net/11536/28416	-
dc.description.abstract	The influence of current density, duty cycle, and frequency of the applied pulse current on film qualities of electroplated copper was discussed. With various filled damascene structures, the corresponding filling power was optimized in a range of pulse current frequency. The optimized pulse current plating in conjunction with a leveler-free electrolyte resulted in a defect-free filling in approximate 100 nm damascenes and reduced the resistivity of Cu deposits. (C) 2002 American Vacuum Society.	en_US
dc.language.iso	en_US	en_US
dc.title	Investigations of pulse current electrodeposition for damascene copper metals	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1116/1.1518974	en_US
dc.identifier.journal	JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B	en_US
dc.citation.volume	20	en_US
dc.citation.issue	6	en_US
dc.citation.spage	2295	en_US
dc.citation.epage	2298	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000180307300022	-
dc.citation.woscount	12	-
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