完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin, Chih-Yang | en_US |
dc.contributor.author | Lee, Dai-Ying | en_US |
dc.contributor.author | Wang, Sheng-Yi | en_US |
dc.contributor.author | Lin, Chun-Chieh | en_US |
dc.contributor.author | Tseng, Tseung-Yuen | en_US |
dc.date.accessioned | 2014-12-08T15:42:03Z | - |
dc.date.available | 2014-12-08T15:42:03Z | - |
dc.date.issued | 2008-12-25 | en_US |
dc.identifier.issn | 0257-8972 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/j.surfcoat.2008.07.004 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/28576 | - |
dc.description.abstract | Sputter-deposited CeO(2) film in the metal-insulator-metal structure exhibits repeatable resistive switching behavior under voltage sweep. Based on the X-ray diffraction patterns and the cross-sectional scanning electron microscope image, the CeO(2) film is polycrystalline with columnar grains perpendicular to the bottom electrode. Moreover, due to the symmetric device structure of Pt/CeO(2)/Pt, the resistive switching behavior is independent of bias polarity so that both positive and negative voltages can switch the device from high conducting state (ON-state) into low conducting state (OFF-state) and then back to ON-state, which is named non-polar resistive switching. The resistance ratio between two memory states is about five orders of magnitude, which is stable over 10(4) S at 0.3 V stress. in addition, the resistance ratio decreases with increasing the current compliance during forming process. The stability of ON-state, OFF-state, and as-deposited film state (the state before performing forming process) against temperature is also investigated in this study, showing that the OFF-state is less stable. (C) 2008 Elsevier B.V. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Reproducible resistive switching behavior in sputtered CeO(2) polycrystalline films | en_US |
dc.type | Article; Proceedings Paper | en_US |
dc.identifier.doi | 10.1016/j.surfcoat.2008.07.004 | en_US |
dc.identifier.journal | SURFACE & COATINGS TECHNOLOGY | en_US |
dc.citation.volume | 203 | en_US |
dc.citation.issue | 5-7 | en_US |
dc.citation.spage | 480 | en_US |
dc.citation.epage | 483 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
顯示於類別: | 會議論文 |