Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lin, JM | en_US |
dc.contributor.author | Yi, KE | en_US |
dc.contributor.author | Chang, YW | en_US |
dc.date.accessioned | 2014-12-08T15:42:08Z | - |
dc.date.available | 2014-12-08T15:42:08Z | - |
dc.date.issued | 2002-08-01 | en_US |
dc.identifier.issn | 1350-2409 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1049/ip-cds:20020433 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/28619 | - |
dc.description.abstract | The module placement problem is to determine the co-ordinates of logic modules in a chip such that no two modules overlap and some cost (e.g. silicon area, interconnection length, etc.) is optimised. To shorten connections between inputs and outputs and/or make related modules adjacent, it is desired to place some modules along the specific boundaries of a chip. To deal with such boundary constraints, we explore the feasibility conditions of a B*-tree with boundary constraints and develop a simulated annealing-based algorithm using B*-trees. Unlike most previous work, the proposed algorithm guarantees a feasible B*-tree with boundary constraints for each perturbation. Experimental results show that the algorithm can obtain a smaller silicon area than the most recent work based on sequence pairs. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Module placement with boundary constraints using B*-trees | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1049/ip-cds:20020433 | en_US |
dc.identifier.journal | IEE PROCEEDINGS-CIRCUITS DEVICES AND SYSTEMS | en_US |
dc.citation.volume | 149 | en_US |
dc.citation.issue | 4 | en_US |
dc.citation.spage | 251 | en_US |
dc.citation.epage | 256 | en_US |
dc.contributor.department | 資訊工程學系 | zh_TW |
dc.contributor.department | Department of Computer Science | en_US |
dc.identifier.wosnumber | WOS:000178389700008 | - |
dc.citation.woscount | 8 | - |
Appears in Collections: | Articles |
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