Using buried capacitor in LTCC-MLC balun

Abstract

A novel chip-type ceramic balun designed in the 2.4 GHz ISM band frequency is presented. A buried capacitor is included in the balun, so that the length of the coupled transmission lines can be reduced and can be designed very easily. A meander or spiral broadside coupled-line is adopted to realise the proposed LTCC multi-layer balun. The measured performances of phase and amplitude balance for this LTCC-MLC balun show a good match with computer simulation.