Using buried capacitor in LTCC-MLC balun

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DC Field	Value	Language
dc.contributor.author	Tang, CW	en_US
dc.contributor.author	Chang, CY	en_US
dc.date.accessioned	2014-12-08T15:42:11Z	-
dc.date.available	2014-12-08T15:42:11Z	-
dc.date.issued	2002-07-18	en_US
dc.identifier.issn	0013-5194	en_US
dc.identifier.uri	http://dx.doi.org/10.1049/el:20020586	en_US
dc.identifier.uri	http://hdl.handle.net/11536/28660	-
dc.description.abstract	A novel chip-type ceramic balun designed in the 2.4 GHz ISM band frequency is presented. A buried capacitor is included in the balun, so that the length of the coupled transmission lines can be reduced and can be designed very easily. A meander or spiral broadside coupled-line is adopted to realise the proposed LTCC multi-layer balun. The measured performances of phase and amplitude balance for this LTCC-MLC balun show a good match with computer simulation.	en_US
dc.language.iso	en_US	en_US
dc.title	Using buried capacitor in LTCC-MLC balun	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1049/el:20020586	en_US
dc.identifier.journal	ELECTRONICS LETTERS	en_US
dc.citation.volume	38	en_US
dc.citation.issue	15	en_US
dc.citation.spage	801	en_US
dc.citation.epage	803	en_US
dc.contributor.department	電信工程研究所	zh_TW
dc.contributor.department	Institute of Communications Engineering	en_US
dc.identifier.wosnumber	WOS:000177339100025	-
dc.citation.woscount	9	-
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