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dc.contributor.authorCHIN, SPen_US
dc.contributor.authorWU, CYen_US
dc.date.accessioned2014-12-08T15:04:23Z-
dc.date.available2014-12-08T15:04:23Z-
dc.date.issued1993-09-01en_US
dc.identifier.issn0278-0070en_US
dc.identifier.urihttp://dx.doi.org/10.1109/43.240081en_US
dc.identifier.urihttp://hdl.handle.net/11536/2878-
dc.description.abstractA general analytical method is proposed to transform a 2-D multilayer physical domain with the nonplanar semiconductor surface into a 2-D rectangular mathematical domain with the planar surface, in which a set of Fourier series are used to describe a general conformal mapping for each layer. Based on the proposed method, a simple iteration algorithm, which incorporates a nonlinear Jacobian-iteration method with the fast- Fourier transformation (FFT), is developed to solve a system of nonlinear equations due to the mutually coupled boundary conditions. As a result of the analytical conformal mapping, a regular, deformable grid-structure can be applied to simulate the device structure with the nonplanar semiconductor surface, and the device simulator using the conventional rectangle-based grid can be easily modified to simulate the device with the nonplanar semiconductor surface.en_US
dc.language.isoen_USen_US
dc.titleA NEW GRID-GENERATION METHOD FOR 2-D SIMULATION OF DEVICES WITH NONPLANAR SEMICONDUCTOR SURFACEen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/43.240081en_US
dc.identifier.journalIEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMSen_US
dc.citation.volume12en_US
dc.citation.issue9en_US
dc.citation.spage1337en_US
dc.citation.epage1344en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1993ME78400009-
dc.citation.woscount0-
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