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dc.contributor.authorChen, SBen_US
dc.contributor.authorLai, CHen_US
dc.contributor.authorChan, KTen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorHsieh, JCen_US
dc.contributor.authorLiu, Jen_US
dc.date.accessioned2014-12-08T15:42:34Z-
dc.date.available2014-12-08T15:42:34Z-
dc.date.issued2002-04-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.992839en_US
dc.identifier.urihttp://hdl.handle.net/11536/28901-
dc.description.abstractWe have characterized the capacitance and loss tangent for high-k Al2O3 and AlTiOx gate dielectrics from IF (100 KHz) to RF (20 GHz) frequency range. Nearly the same rate of capacitance reduction as SiO2 was demonstrated individually by the proposed Al2O3 and AlTiOx gate dielectrics as frequency was increased. Moreover, both dielectrics preserve the higher k better than SiO2 from 100 KHz to 20 GHz. These results suggest that both Al2O3 and AlTiOx are suitable for next generation MOSFET application into RF frequency regime.en_US
dc.language.isoen_USen_US
dc.subjectdielectric constanten_US
dc.subjectfrequency dependenceen_US
dc.subjecthigh ken_US
dc.subjectloss tangenten_US
dc.subjectRFen_US
dc.titleFrequency-dependent capacitance reduction in high-k AlTiOx and Al2O3 gate dielectrics from IF to RF frequency rangeen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.992839en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume23en_US
dc.citation.issue4en_US
dc.citation.spage203en_US
dc.citation.epage205en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000174667800013-
dc.citation.woscount37-
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