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dc.contributor.authorLu, CAen_US
dc.contributor.authorChang, Len_US
dc.contributor.authorHuang, BRen_US
dc.date.accessioned2014-12-08T15:42:47Z-
dc.date.available2014-12-08T15:42:47Z-
dc.date.issued2002-03-01en_US
dc.identifier.issn0925-9635en_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0925-9635(01)00588-Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/29004-
dc.description.abstractDiamond films on 3-inch diameter (100) silicon wafers were synthesized with bias during microwave plasma vapor deposition (MPCVD). The deposition parameters were as follows: 0.13% CH4 in H-2 pressure at 30 torr; deposition temperature at 768-869 degreesC, and a deposition time of 3-3.5 h. The bias voltage applied to the substrates during diamond growth varied from 0 to -450 V. The deposited films were characterized by Raman spectroscopy and electron microscopy. The results show that the film properties are uniform across the whole 3-inch diameter area. Raman spectra show that the ratio of sp(3) to sp(2) is increased with the bias voltage up to -350 V, while further increases in voltage resulted in a decreased ratio. It was found that column-shaped grains of diamond were directly grown from the substrate surface without grain coalescence in the lateral direction during growth. The nucleation density of diamond with biased growth was of the order of 10(9) cm(-2). (C) 2002 Elsevier Science B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectdiamond filmsen_US
dc.subjectCVDen_US
dc.subjectbiasen_US
dc.subjectRaman spectroscopyen_US
dc.titleGrowth of diamond films with bias during microwave plasma chemical vapor depositionen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/S0925-9635(01)00588-Xen_US
dc.identifier.journalDIAMOND AND RELATED MATERIALSen_US
dc.citation.volume11en_US
dc.citation.issue3-6en_US
dc.citation.spage523en_US
dc.citation.epage526en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000176046300049-
Appears in Collections:Conferences Paper


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