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dc.contributor.authorCheng, CMen_US
dc.contributor.authorChen, RHen_US
dc.date.accessioned2014-12-08T15:43:18Z-
dc.date.available2014-12-08T15:43:18Z-
dc.date.issued2001-11-01en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttp://dx.doi.org/10.1088/0960-1317/11/6/310en_US
dc.identifier.urihttp://hdl.handle.net/11536/29312-
dc.description.abstractThis paper presents a novel development method for fabricating high aspect ratio microstructures in deep x-ray lithography. In this method, microstructures are developed downward to utilize the difference of the specific weight between the development products and the developer to efficiently remove the development products. The development behaviours of the proposed method (downward-development) are investigated and compared with the conventional method (upward-development). Experimental results indicate that the developing rate of downward-development is approximately twice that obtained by upward-development. Additionally, the development products are easily removed and a satisfactory microstructure quality is achieved via this process. The proposed method also yields accurate predictability to estimate the necessary developing time. Moreover, the elevated temperature increases the developing rate of downward-development more sensitively than for upward-development.en_US
dc.language.isoen_USen_US
dc.titleDevelopment behaviours and microstructure quality of downward-development in deep x-ray lithographyen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/0960-1317/11/6/310en_US
dc.identifier.journalJOURNAL OF MICROMECHANICS AND MICROENGINEERINGen_US
dc.citation.volume11en_US
dc.citation.issue6en_US
dc.citation.spage692en_US
dc.citation.epage696en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000172523900010-
dc.citation.woscount11-
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