完整後設資料紀錄
DC 欄位語言
dc.contributor.authorPan, TMen_US
dc.contributor.authorChien, CHen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorChao, TSen_US
dc.contributor.authorHuang, TYen_US
dc.date.accessioned2014-12-08T15:43:27Z-
dc.date.available2014-12-08T15:43:27Z-
dc.date.issued2001-09-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1387225en_US
dc.identifier.urihttp://hdl.handle.net/11536/29415-
dc.description.abstractElectrical proper-ties of CeO2 films prepared by reactive dc sputtering on Si(100) substrate with and without the incorporation of a thin barrier layer were investigated. X-ray diffraction spectra revealed that without the thin barrier layer, single-crystal CeO2 is formed on Si(100) substrate. At an equivalent oxide thickness of 2.8 nm, CeO2 films exhibit a leakage current which is four orders of magnitude lower than that of the conventional SiO2 film at an applied bias of 2 V. Only negligible stress-induced leakage current is observed after high field stressing. The incorporation of the thin silicon nitride buffer layer, however, degraded the crystalline structure of CeO2, accompanied by deteriorated electrical properties such as leakage current and fixed charges. CeO2 film without the barrier layer is thus attractive as the high dielectric constant gate insulator for future ultralarge scale integration devices. (C) 2001 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleElectrical characteristics of thin cerium oxide film on silicon substrate by reactive DC sputteringen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1387225en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume4en_US
dc.citation.issue9en_US
dc.citation.spageF15en_US
dc.citation.epageF17en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000170425000012-
dc.citation.woscount7-
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