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dc.contributor.authorLoong, WAen_US
dc.contributor.authorLin, CMen_US
dc.contributor.authorTseng, SPen_US
dc.contributor.authorYeh, WLen_US
dc.date.accessioned2014-12-08T15:43:29Z-
dc.date.available2014-12-08T15:43:29Z-
dc.date.issued2001-09-01en_US
dc.identifier.issn0167-9317en_US
dc.identifier.urihttp://hdl.handle.net/11536/29433-
dc.description.abstractWe reported that the optical and physical properties of TiSixNy thin films formed by sputtering are suitable to be used as an embedded layer in 193 nm. The TiSixNy films were deposited under DC power of Ti target 170-220 W, RF power of Si target 50-110 W, Ar 50 sccm and N-2 3-7 sccm. The increasing of the atomic percentage of nitrogen in TiSixNy has a good agreement with its n and k. With the formation of Si3N4 and TiN structures, the TiSixNy thin film's n started to increase, k to decrease. After the saturation of formations of Si3N4 and TiN structures, the Si and Ti states started to show up, resulted this thin film's n to decrease, and k to increase. The n and k values were calculated by our modified R-T (reflectance-transmittance) method. Controlling a thin film's compositions during sputtering could allow the manipulation of its n and k. (C) 2001 Elsevier Science B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectTiSixNyen_US
dc.subjectembedded layeren_US
dc.subjectchemical compositionsen_US
dc.subjectoptical propertiesen_US
dc.titleThe correlation between the chemical compositions and optical properties of TiSixNy as an embedded layer for AttPSM in 193 nmen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.journalMICROELECTRONIC ENGINEERINGen_US
dc.citation.volume57-8en_US
dc.citation.issueen_US
dc.citation.spage481en_US
dc.citation.epage487en_US
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:000171061800066-
Appears in Collections:Conferences Paper