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dc.contributor.authorLee, JWen_US
dc.contributor.authorChen, WDen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorLee, CLen_US
dc.date.accessioned2014-12-08T15:43:37Z-
dc.date.available2014-12-08T15:43:37Z-
dc.date.issued2001-08-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1383554en_US
dc.identifier.urihttp://hdl.handle.net/11536/29490-
dc.description.abstractDisilane-based stacked structures were first proposed to demonstrate that the nitrogen incorporation was enhanced in the RTN2O annealed tetraethylorthosilicate (TEOS) oxide fabricated on disilane-based polysilicon films. Compared with the oxide fabricated on the silane-based polysilicon film, the nitrogen incorporation in the disilane-based oxides is six times higher. To study the nitrogen incorporation effects on the RTN2O annealed TEOS oxides, the disilane-based polysilicon stacked on the silane-based polysilicon film structure was proposed. We found that the oxide quality was largely improved by the same surface morphology of bottom polysilicon films. We think the this approach could be used in fabricating dynamic random access memory (DRAM) to have better data retention characteristics and to improve the reliability of DRAM and flash memory devices. (C) 2001 The Electrochemical Society. [DOI: 10.1149/1.1383554] All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleThe enhancement of nitrogen incorporation in RTN2O annealed TEOS oxide fabricated on disilane-based polysilicon filmsen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1383554en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume148en_US
dc.citation.issue8en_US
dc.citation.spageF164en_US
dc.citation.epageF169en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000170400700045-
dc.citation.woscount1-
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