完整後設資料紀錄
DC 欄位語言
dc.contributor.authorSha, DYen_US
dc.contributor.authorHsieh, LFen_US
dc.contributor.authorChen, KJen_US
dc.date.accessioned2014-12-08T15:43:46Z-
dc.date.available2014-12-08T15:43:46Z-
dc.date.issued2001-06-01en_US
dc.identifier.issn1072-4761en_US
dc.identifier.urihttp://hdl.handle.net/11536/29580-
dc.description.abstractDefective wafers are often seen during the semiconductor manufacturing process. Technically, there is no known remedy for a defective wafer. However, at the photolithography phase of semiconductor manufacturing, the defective wafers can be reworked to reduce the manufacturing cost significantly. In this paper, when comparing the three rework strategies that were proposed by Zargar, we pinpoint the disadvantages of each and offer two other strategies. We assess the advantages and disadvantages of the five rework strategies of each reworked batch according to total cycle time, the quantity of work-in-process, each machine's utilization rate, the utilization rate of photolithography, and the average length of queues for photolithography. Through simulations and statistics, the fifth strategy is shown to be superior to the first four and most suitable for wafer manufacturing. Significance: At the photolithography stage, the processing relation between lot and lot should be considered. Thus, how to schedule reworking in order to reduce the effect on waiting lots is a crucial issue for wafer manufacturing management.en_US
dc.language.isoen_USen_US
dc.subjectrework strategyen_US
dc.subjectmother loten_US
dc.subjectchild loten_US
dc.subjectcycle timeen_US
dc.subjectutilizationen_US
dc.subjectsimulationen_US
dc.titleWafer rework strategies at the photolithography stageen_US
dc.typeArticleen_US
dc.identifier.journalINTERNATIONAL JOURNAL OF INDUSTRIAL ENGINEERING-THEORY APPLICATIONS AND PRACTICEen_US
dc.citation.volume8en_US
dc.citation.issue2en_US
dc.citation.spage122en_US
dc.citation.epage130en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000171743400005-
dc.citation.woscount9-
顯示於類別:期刊論文