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dc.contributor.authorChang, Chia-Wenen_US
dc.contributor.authorDeng, Chih-Kangen_US
dc.contributor.authorChang, Che-Lunen_US
dc.contributor.authorLiao, Ta-Chuanen_US
dc.contributor.authorLei, Tan-Fuen_US
dc.date.accessioned2014-12-08T15:44:21Z-
dc.date.available2014-12-08T15:44:21Z-
dc.date.issued2008-04-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.47.3024en_US
dc.identifier.urihttp://hdl.handle.net/11536/29954-
dc.description.abstractHigh-performance solid-phase crystallized polycrystalline silicon thin-film transistors with a floating-channel active region (FC poly-Si TFTs) are proposed in this study. A high-quality poly-Si channel film accompanied by a larger grain size and fewer microstructural defects could be obtained. Compared with the conventional poly-Si TFTs (CN poly-Si TFTs), the fabricated FC poly-Si TFTs exhibit superior electrical characteristics, including lower threshold voltage, higher field-effect mobility, and lower trap state density. These electrical performance improvements could be attributed to the fact that the a-Si film with a floating-channel structure can relieve the stress generated from the crystallization process accompanying the trap state density reduction and grain size enhancement. In addition, the FC poly-Si TFTs also exhibit improved hot-carrier stress immunity due to the reduced weak Si-H bonds from fewer grain boundaries in the poly-Si channel. Therefore, the proposed FC poly-Si TFTs can be easily fabricated by conventional solid-phase crystallization, and suitable for future high-performance flat-panel display applications.en_US
dc.language.isoen_USen_US
dc.subjectfloating-channel structureen_US
dc.subjectsurface nucleationen_US
dc.subjectsolid-phase crystallization (SPC)en_US
dc.subjectthin-film transistor (TFT)en_US
dc.titleHigh-performance solid-phase crystallized polycrystalline silicon thin-film transistors with floating-channel structureen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1143/JJAP.47.3024en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume47en_US
dc.citation.issue4en_US
dc.citation.spage3024en_US
dc.citation.epage3027en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000255449100152-
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