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dc.contributor.authorLin, CMen_US
dc.contributor.authorLoong, WAen_US
dc.date.accessioned2014-12-08T15:44:44Z-
dc.date.available2014-12-08T15:44:44Z-
dc.date.issued2000-11-01en_US
dc.identifier.issn1071-1023en_US
dc.identifier.urihttp://dx.doi.org/10.1116/1.1319835en_US
dc.identifier.urihttp://hdl.handle.net/11536/30190-
dc.description.abstractThe formation and variation of AlN, Si3N4, and nitride compositions in AlSixNy (x similar to0.31, y similar to0.51) embedded material have been shown to correlate with its optical properties. The increasing content of AIN, Si3N4, and nitrides will increase n and decrease k of AlSixNy. A simple and effective correction of measured reflectance R% and transmittance T% based on scalar scattering theory has been applied to the R-T method for determining It and k of embedded layers for 193 nm lithography masks. A 0.2 mum etched pattern of an AlSixNy embedded layer on an oxide/Si wafer substrate was successfully fabricated. (C) 2000 American Vacuum Society. [S0734-211X(oo)08906-X].en_US
dc.language.isoen_USen_US
dc.titleCorrelation between the chemical compositions and optical properties of AlSixNy embedded layer for attenuated phase-shifting mask in 193 nm and the modification of the R-T method for measuring n and ken_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1116/1.1319835en_US
dc.identifier.journalJOURNAL OF VACUUM SCIENCE & TECHNOLOGY Ben_US
dc.citation.volume18en_US
dc.citation.issue6en_US
dc.citation.spage3371en_US
dc.citation.epage3375en_US
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:000165935800145-
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