Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)

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DC Field	Value	Language
dc.contributor.author	Gau, WC	en_US
dc.contributor.author	Chang, TC	en_US
dc.contributor.author	Lin, YS	en_US
dc.contributor.author	Hu, JC	en_US
dc.contributor.author	Chen, LJ	en_US
dc.contributor.author	Chang, CY	en_US
dc.contributor.author	Cheng, CL	en_US
dc.date.accessioned	2014-12-08T15:44:54Z	-
dc.date.available	2014-12-08T15:44:54Z	-
dc.date.issued	2000-09-01	en_US
dc.identifier.issn	0734-2101	en_US
dc.identifier.uri	http://dx.doi.org/10.1116/1.1286102	en_US
dc.identifier.uri	http://hdl.handle.net/11536/30314	-
dc.language.iso	en_US	en_US
dc.title	Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)	en_US
dc.type	Correction	en_US
dc.identifier.doi	10.1116/1.1286102	en_US
dc.identifier.journal	JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS	en_US
dc.citation.volume	18	en_US
dc.citation.issue	5	en_US
dc.citation.spage	2597	en_US
dc.citation.epage	2597	en_US
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.identifier.wosnumber	WOS:000089434800087	-
dc.citation.woscount	0	-
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