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dc.contributor.authorWu, YHen_US
dc.contributor.authorYang, MYen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorChen, WJen_US
dc.contributor.authorKwei, CMen_US
dc.date.accessioned2014-12-08T15:45:06Z-
dc.date.available2014-12-08T15:45:06Z-
dc.date.issued2000-07-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.847374en_US
dc.identifier.urihttp://hdl.handle.net/11536/30423-
dc.description.abstractElectrical and reliability properties of ultrathin La2O3 gate dielectric have been investigated. The measured capacitance of 33 Angstrom La2O3 gate dielectric is 7.2 mu F/cm(2) that gives an effective K value of 27 and an equivalent oxide thickness of 4.8 Angstrom. Good dielectric integrity is evidence from the low leakage current density of 0.06 A/cm(2) at -1 V, high effective breakdown field of 13.5 MV/cm, low interface-trap density of 3 x 10(10) eV-1/cm(2), and excellent reliability with more than 10 years lifetime even at 2 V bias. In addition to high K, these dielectric properties are very close to conventional thermal SiO2.en_US
dc.language.isoen_USen_US
dc.subjecthigh K dielectricen_US
dc.subjectleakage currenten_US
dc.subjectreliabilityen_US
dc.titleElectrical characteristics of high quality La2O3 gate dielectric with equivalent oxide thickness of 5 angstromen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.847374en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume21en_US
dc.citation.issue7en_US
dc.citation.spage341en_US
dc.citation.epage343en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000087898300005-
dc.citation.woscount150-
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