Characteristics of SiC-based thin-film LED fabricated using plasma-enhanced CVD system with stainless steel mesh

Abstract

A conventional plasma-enhanced chemical vapour deposition (PECVD) system with a stainless steel mesh attached to a cathode was used to fabricate an SiC-based thin-mm light-emitting diode (TFLED) at a low temperature (similar to 180 degrees C). The obtained TFLED had a brightness (B) of 1060cd/m(2) at an injection current density (J) of 600mA/cm(2) and a threshold voltage (V-th) of 12.6V, which were much better than those of 330cd/m(2) and 18.5V for an amorphous SiC-based TFLED fabricated by the same PECVD system without a stainless steel mesh.