完整後設資料紀錄
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dc.contributor.authorTseng, TYen_US
dc.date.accessioned2014-12-08T15:47:12Z-
dc.date.available2014-12-08T15:47:12Z-
dc.date.issued1999en_US
dc.identifier.issn0015-0193en_US
dc.identifier.urihttp://hdl.handle.net/11536/31658-
dc.description.abstract(Ba,Sr)TiO3 thin films are important capacitor materials for future gigabit era dynamic random access memory (DRAM) applications. This article reviews the technological aspects of BST films, including thin films deposition techniques, post annealing, physical, electrical and dielectric characteristics of the films, effects of bottom electrode materials, complex plane analysis of AC electrical, dielectric relaxation, and defect and reliability phenomena associated with the films. In addition, possible future developments are briefly summarized.en_US
dc.language.isoen_USen_US
dc.subjectBSTen_US
dc.subjectthin filmsen_US
dc.subjectpropertiesen_US
dc.subjectreliabilityen_US
dc.title(Ba,Sr)TiO3 thin films: Preparation, properties and reliabilityen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.journalFERROELECTRICSen_US
dc.citation.volume232en_US
dc.citation.issue1-4en_US
dc.citation.spage881en_US
dc.citation.epage893en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000165296900002-
顯示於類別:會議論文