標題: Precision alignment of mask etching with respect to crystal orientation
作者: Lai, JM
Chieng, WH
Huang, YC
機械工程學系
電子工程學系及電子研究所
Department of Mechanical Engineering
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-Dec-1998
摘要: For most micro-mechanical devices, a high precision alignment of mask pattern to crystal orientation is preferred. Such alignment even becomes critical for devices that simultaneously require a smooth sidewall and minimal undercut. In this article, we present an innovative pre-etching pattern to determine the [110] crystal orientation on [100] silicon wafers. This pattern etched on the wafer allows us to determine the crystal orientation within an accuracy of 0.01 degrees. Such a pre-etching pattern can be used as a valuable reference for all subsequent mask patterns.
URI: http://dx.doi.org/10.1088/0960-1317/8/4/011
http://hdl.handle.net/11536/31694
ISSN: 0960-1317
DOI: 10.1088/0960-1317/8/4/011
期刊: JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume: 8
Issue: 4
起始頁: 327
結束頁: 329
Appears in Collections:Articles


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