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dc.contributor.authorLin, CRen_US
dc.contributor.authorKuo, CTen_US
dc.contributor.authorChang, RMen_US
dc.date.accessioned2014-12-08T15:47:15Z-
dc.date.available2014-12-08T15:47:15Z-
dc.date.issued1998-12-01en_US
dc.identifier.issn0925-9635en_US
dc.identifier.urihttp://hdl.handle.net/11536/31696-
dc.description.abstractDiamond films were deposited on the cemented WC+(3-5)% Co substrates by a microwave plasma chemical vapor deposition system. The substrates were pretreated with various processing steps before diamond deposition, including: polishing, etching for Co removal, Ti coating by DC sputter, and amorphous Si coating by E-gun. The residual stress of the films was determined by both Raman shift and low incident beam angle X-ray diffraction (LIBAD) methods. The adhesion of the films was evaluated by indentation adhesion testing. The him morphology and film-substrate interface structure were examined by SEM and Auger electron spectroscopy, respectively. The results show that Ti-Si can be a good interlayer to improve film adhesion and inhibit diffusion of Co to the substrate surface on diamond nucleation. This is due to the formation of strong TiC and SiC bonding to enhance film adhesion; Si acts as a promoter for diamond nucleation, and the residual stress with application of interlayer is much lower than that interlayer-free. The results also show the existence of an optimum Ti thickness for the best film adhesion. (C) 1998 Elsevier Science S.A. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectadhesionen_US
dc.subjectdiamond filmsen_US
dc.subjectmicrowave plasma CVDen_US
dc.subjectstressen_US
dc.titleImprovement in adhesion of diamond films on cemented WC substrate with Ti-Si interlayersen_US
dc.typeArticleen_US
dc.identifier.journalDIAMOND AND RELATED MATERIALSen_US
dc.citation.volume7en_US
dc.citation.issue11-12en_US
dc.citation.spage1628en_US
dc.citation.epage1632en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000077617300006-
dc.citation.woscount30-
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