Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Wu, CY | en_US |
dc.contributor.author | Hou, HM | en_US |
dc.date.accessioned | 2014-12-08T15:47:36Z | - |
dc.date.available | 2014-12-08T15:47:36Z | - |
dc.date.issued | 1998-10-01 | en_US |
dc.identifier.issn | 0038-1101 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/31857 | - |
dc.description.abstract | An efficient method is presented to model the transient characteristics of distributed resistor-capacitor of ULSI multilevel interconnections on complex topography, in which the reformulation of the boundary-element method (BEM) associated with the Padi-via-Lanczos (PVL) algorithm can avoid the redundant works on both volume mesh and transient analysis associated with the finite-difference method. An adaptive multilayer closed-form spatial Green's function for BEM is developed to examine the voltage and current responses of the multilevel conductor system by using the boundary-element method of integral formulation, in which arbitrary triangular elements on the surface of conductors are used to efficiently calculate the free-charge distributions of complex structure based on actual topography/processes. Applying the Galerkin principle over boundary elements, all of the surface integrals of charge distribution have been discretized and evaluated analytically for constant element. To improve the timing-analysis efficiency of the finite-difference method, the dominant poles are obtained by introducing the Pade-via-Lanczos (PVL) algorithm for model-order reduction. Hence, it is easy to calculate the transient characteristics of both parallel conductors and complicated configurations such as crossing lines, corners, contacts, multilayers and their combinations. Therefore, a simple and more general method is proposed for solving the combinations of complex structures based on actual topography/processes and arbitrary geometric configurations of multilevel interconnection lines in order to link with the present CAD tools. (C) 1998 Published by Elsevier Science Ltd. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.title | An efficient transient modeling for 3-D multilevel interconnections in a stratified dielectric medium | en_US |
dc.type | Article | en_US |
dc.identifier.journal | SOLID-STATE ELECTRONICS | en_US |
dc.citation.volume | 42 | en_US |
dc.citation.issue | 10 | en_US |
dc.citation.spage | 1881 | en_US |
dc.citation.epage | 1891 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000076523100017 | - |
dc.citation.woscount | 0 | - |
Appears in Collections: | Articles |
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