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dc.contributor.authorSahoo, Kartika Chandraen_US
dc.contributor.authorKuo, Chien-Ien_US
dc.contributor.authorLi, Yimingen_US
dc.contributor.authorChang, Edward Yien_US
dc.date.accessioned2014-12-08T15:48:09Z-
dc.date.available2014-12-08T15:48:09Z-
dc.date.issued2010-10-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2010.2062521en_US
dc.identifier.urihttp://hdl.handle.net/11536/32108-
dc.description.abstractIn this paper, we report the first result of a strained In(0.52)Ga(0.48) As channel high-electron mobility transistor (HEMT) featuring highly doped In(0.4)Ga(0.6) As source/drain (S/D) regions. A lattice mismatch of 0.9% between In(0.52)Ga(0.48) As and In(0.4)Ga(0.6) As S/D has resulted in a lateral strain in the In(0.52)Ga(0.48) As channel region, where the series resistance is reduced with highly doped S/D regions. An experimentally validated device simulation is advanced for the proposed HEMT, and the results of this paper have shown that there are 60% drive-current and 100% transconductance improvements, compared with the conventional structure. A remarkable 150-GHz increase in the cutoff frequency has been seen for the proposed structure over the conventional one as well for the shown devices.en_US
dc.language.isoen_USen_US
dc.subjectDevice simulationen_US
dc.subjectDC and ac characteristicsen_US
dc.subjectHEMTen_US
dc.subjectInGaAsen_US
dc.subjectstrained channelen_US
dc.titleNovel Metamorphic HEMTs With Highly Doped InGaAs Source/Drain Regions for High Frequency Applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2010.2062521en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume57en_US
dc.citation.issue10en_US
dc.citation.spage2594en_US
dc.citation.epage2598en_US
dc.contributor.department傳播研究所zh_TW
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentInstitute of Communication Studiesen_US
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
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