完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Tsai, JW | en_US |
dc.contributor.author | Huang, CY | en_US |
dc.contributor.author | Tai, YH | en_US |
dc.contributor.author | Cheng, HC | en_US |
dc.contributor.author | Su, FC | en_US |
dc.contributor.author | Luo, FC | en_US |
dc.contributor.author | Tuan, HC | en_US |
dc.date.accessioned | 2014-12-08T15:01:29Z | - |
dc.date.available | 2014-12-08T15:01:29Z | - |
dc.date.issued | 1997-09-01 | en_US |
dc.identifier.issn | 0003-6951 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/322 | - |
dc.description.abstract | A short H-2 plasma treatment of the gate SiNx before depositing amorphous silicon (a-Si:H) is found to significantly decrease the threshold shifts in the bias stress, inverted a-Si:H thin film transistors (TFTs). The reduced threshold voltage shift is attributed to a plasma induced reconstruction of SiNx precursors leading to the removal of the weak bonds. A prolonged plasma treatment, however, degraded the TFT characteristics; this was traced H-2 plasma damage which eventually generated a rough a-Si:H/SiNx interface. (C) 1997 American Institute of Physics. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Reducing threshold voltage shifts in amorphous silicon thin film transistors by hydrogenating the gate nitride prior to amorphous silicon deposition | en_US |
dc.type | Article | en_US |
dc.identifier.journal | APPLIED PHYSICS LETTERS | en_US |
dc.citation.volume | 71 | en_US |
dc.citation.issue | 9 | en_US |
dc.citation.spage | 1237 | en_US |
dc.citation.epage | 1239 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
顯示於類別: | 期刊論文 |