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dc.contributor.authorChang, Chun-Weien_US
dc.contributor.authorHsu, Wensyangen_US
dc.date.accessioned2014-12-08T15:48:51Z-
dc.date.available2014-12-08T15:48:51Z-
dc.date.issued2008en_US
dc.identifier.isbn978-0-8194-7059-1en_US
dc.identifier.issn0277-786Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/32475-
dc.identifier.urihttp://dx.doi.org/10.1117/12.765665en_US
dc.description.abstractOptical MEMS devices rely on the micro assembly to achieve re-positioning, such as lifted up micro mirrors and lens and micro resistance welding benefits assembly of optical components. However, the characteristics of micro resistance welding are still unknown. The purpose of this study is to characterize micro resistance welding with electro-thermal actuator for micro assembly. In order to characterize influence of operation parameters on micro resistance welding, important parameters including contact pressure, contact resistance and electrical energy are calibrated. Further, welding strength provide robust join are also measured. The idea of resistance welding is based on generated heat by ohm's law to melt material. From measured results, contact resistance decreases with increasing contact pressure due to increasing contact area. The stronger welding strength can be achieved at a smaller initial contact resistance which means that a larger clamping force could enhance the welding strength. The maximum welding strength is 74.4 mu N at 2.7 Omega. Further, welding energy affects yield significantly. At high welding energy, between 1 to 10 J, the yield can reach 100%. The energy below 0.05 J would not generate adequate heat to weld structure.en_US
dc.language.isoen_USen_US
dc.subjectmicro resistance weldingen_US
dc.subjectmicro assemblyen_US
dc.subjectthermal fusionen_US
dc.subjectthermal assemblyen_US
dc.subjectmicro weldingen_US
dc.titleCharacterization of micro resistance welding with electro-thermal actuator for micro assembly - art. no. 68840Gen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1117/12.765665en_US
dc.identifier.journalRELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS VIIen_US
dc.citation.volume6884en_US
dc.citation.spageG8840en_US
dc.citation.epageG8840en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000255942000014-
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