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dc.contributor.authorWang, THen_US
dc.contributor.authorChang, TEen_US
dc.contributor.authorChiang, LPen_US
dc.contributor.authorWang, CHen_US
dc.contributor.authorZous, NKen_US
dc.contributor.authorHuang, CMen_US
dc.date.accessioned2014-12-08T15:48:54Z-
dc.date.available2014-12-08T15:48:54Z-
dc.date.issued1998-07-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/16.701482en_US
dc.identifier.urihttp://hdl.handle.net/11536/32522-
dc.description.abstractWe proposed a new measurement technique to investigate oxide charge trapping and detrapping in a hot carrier stressed n-MOSFET by measuring a GIDL current transient. This measurement technique is based on the concept that in a MOSFET the Si surface field and thus GIDL current vary with oxide trapped charge. By monitoring the temporal evolution of GIDL current, the oxide charge trapping/detrapping characteristics can be obtained. An analytical model accounting for the time-dependence of an oxide charge detrapping induced GIDL current transient was derived, A specially designed measurement consisting of oxide trap creation, oxide trap filling with electrons or holes and oxide charge detrapping was performed. Two hot carrier stress methods, channel hot electron injection and band-to-band tunneling induced hot hole injection, were employed in this work, Both electron detrapping and hole detrapping induced GIDL current transients were observed in the same device. The time-dependence of the transients indicates that oxide charge detrapping is mainly achieved via field enhanced tunneling. In addition, we used this technique to characterize oxide trap growth in the two hot carrier stress conditions. The result reveals that the hot hole stress is about 10(4) times more efficient in trap generation than the hot electron stress in terms of injected charge.en_US
dc.language.isoen_USen_US
dc.subjectGIDLen_US
dc.subjecthot carrieren_US
dc.subjectoxide trapen_US
dc.subjecttransienten_US
dc.titleInvestigation of oxide charge trapping and detrapping in a MOSFET by using a GIDL current techniqueen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/16.701482en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume45en_US
dc.citation.issue7en_US
dc.citation.spage1511en_US
dc.citation.epage1517en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000074344100017-
dc.citation.woscount38-
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