標題: HUMIDITY EFFECT ON POLYIMIDE FILM ADHESION
作者: HU, DC
CHEN, HC
交大名義發表
材料科學與工程學系
National Chiao Tung University
Department of Materials Science and Engineering
公開日期: 1-十月-1992
摘要: A 90-degrees peel tester with substrate heating capability has been built to evaluate the adhesion strength of polyimide film to silicon substrate. The peel strength of polyimide film is not only a function of film thickness or peeling rate, but also a function of ambient humidity. A mechanism is proposed. The peel strength decreases with increasing relative humidity due to the hydrolysis of polyimide, reaches a minimum, and then increases with increasing relative humidity due to the hydrogen bonding at the weak boundary layer. In a high-humidity environment, peel crack tips are attacked by moisture and result in weak adhesion measurement. Water adsorbed by polyimide film near the crack tip and diffused into the peel crack tip is the main mode of moisture attack. The peel behaviour of polyimide film at the elevated temperature is almost the same as peeling at room temperature in a low-humidity environment.
URI: http://dx.doi.org/10.1007/BF02403827
http://hdl.handle.net/11536/3273
ISSN: 0022-2461
DOI: 10.1007/BF02403827
期刊: JOURNAL OF MATERIALS SCIENCE
Volume: 27
Issue: 19
起始頁: 5262
結束頁: 5268
顯示於類別:期刊論文