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dc.contributor.authorHU, DCen_US
dc.contributor.authorCHEN, HCen_US
dc.date.accessioned2014-12-08T15:04:46Z-
dc.date.available2014-12-08T15:04:46Z-
dc.date.issued1992-10-01en_US
dc.identifier.issn0022-2461en_US
dc.identifier.urihttp://dx.doi.org/10.1007/BF02403827en_US
dc.identifier.urihttp://hdl.handle.net/11536/3273-
dc.description.abstractA 90-degrees peel tester with substrate heating capability has been built to evaluate the adhesion strength of polyimide film to silicon substrate. The peel strength of polyimide film is not only a function of film thickness or peeling rate, but also a function of ambient humidity. A mechanism is proposed. The peel strength decreases with increasing relative humidity due to the hydrolysis of polyimide, reaches a minimum, and then increases with increasing relative humidity due to the hydrogen bonding at the weak boundary layer. In a high-humidity environment, peel crack tips are attacked by moisture and result in weak adhesion measurement. Water adsorbed by polyimide film near the crack tip and diffused into the peel crack tip is the main mode of moisture attack. The peel behaviour of polyimide film at the elevated temperature is almost the same as peeling at room temperature in a low-humidity environment.en_US
dc.language.isoen_USen_US
dc.titleHUMIDITY EFFECT ON POLYIMIDE FILM ADHESIONen_US
dc.typeArticleen_US
dc.identifier.doi10.1007/BF02403827en_US
dc.identifier.journalJOURNAL OF MATERIALS SCIENCEen_US
dc.citation.volume27en_US
dc.citation.issue19en_US
dc.citation.spage5262en_US
dc.citation.epage5268en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:A1992JR57200022-
dc.citation.woscount8-
Appears in Collections:Articles