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dc.contributor.authorJang, SLen_US
dc.contributor.authorChen, HKen_US
dc.contributor.authorChang, KMen_US
dc.date.accessioned2014-12-08T15:49:17Z-
dc.date.available2014-12-08T15:49:17Z-
dc.date.issued1998-03-01en_US
dc.identifier.issn0038-1101en_US
dc.identifier.urihttp://hdl.handle.net/11536/32772-
dc.description.abstractPrestress and poststress low-frequency noise characteristics of buried-channel LDD pMOS-FETs have been studied. The devices were stressed at low gate and high drain bias, and the poststress drain current increases due to the hot-electron induced channel shortening effect. The noise measurements were carried out between 10 Hz and 100 kHz, 1/f(1.2) and generation-recombination current noises have been found in the drain current noises. The poststress 1/f(1.2) drain current noise increases in both the linear and saturation regime. This behavior is attributed to the increase of interface states and oxide electron charges after stress. (C) 1998 Elsevier Science Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleLow-frequency noise characteristics of hot carrier-stressed buried-channel pMOSFETsen_US
dc.typeArticleen_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.citation.volume42en_US
dc.citation.issue3en_US
dc.citation.spage411en_US
dc.citation.epage418en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000073203900018-
dc.citation.woscount2-
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