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dc.contributor.authorWU, JSen_US
dc.contributor.authorLEE, CPen_US
dc.contributor.authorCHANG, CYen_US
dc.contributor.authorCHANG, KHen_US
dc.contributor.authorLIU, DGen_US
dc.contributor.authorLIOU, DCen_US
dc.date.accessioned2014-12-08T15:04:54Z-
dc.date.available2014-12-08T15:04:54Z-
dc.date.issued1992-05-01en_US
dc.identifier.issn0038-1101en_US
dc.identifier.urihttp://hdl.handle.net/11536/3429-
dc.description.abstractThe performance limitations of negative differential resistance (NDR) in AlGaAs/GaAs double-barrier resonant tunneling structures (DBRTSs) have been investigated by varying the barrier thickness and quantum well (QW) width, and by doping In into the barrier layers. For devices with thick barriers (greater-than-or-equal-to 70 angstrom), the scattering in the material is believed to cause the saturation of the peak-to-valley current ratio (PVCR). The dependence of PVCR on the well width, however, is found to be, to the first-order, not related to the scattering mechanisms or other material properties. It is rather an inherent property of the tunneling process under different conditions. On the other hand, it was found that a proper amount of In doping into the barrier layers can increase the PVCR, because of the lower defect concentration, resulting in lower scattering rate in the active region.en_US
dc.language.isoen_USen_US
dc.titleINTRINSIC AND EXTRINSIC EFFECTS ON PERFORMANCE LIMITATION OF ALGAAS/GAAS DOUBLE-BARRIER RESONANT TUNNELING STRUCTURESen_US
dc.typeArticleen_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.citation.volume35en_US
dc.citation.issue5en_US
dc.citation.spage723en_US
dc.citation.epage730en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1992HT52700019-
dc.citation.woscount2-
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