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dc.contributor.authorLai, YLen_US
dc.contributor.authorChang, EYen_US
dc.contributor.authorChang, CYen_US
dc.contributor.authorTai, MCen_US
dc.contributor.authorLiu, THen_US
dc.contributor.authorWang, SPen_US
dc.contributor.authorChuang, KCen_US
dc.contributor.authorLee, CTen_US
dc.date.accessioned2014-12-08T15:01:30Z-
dc.date.available2014-12-08T15:01:30Z-
dc.date.issued1997-09-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.622519en_US
dc.identifier.urihttp://hdl.handle.net/11536/342-
dc.description.abstractWe report a high-efficiency and low-distortion GaAs power MESFET using direct ion implantation technology for the digital wireless personal handy-phone system (PHS). When qualified by 1.9-GHz pi/4-shifted quadrature phase shift keying (QPSK) modulated PBS standard signals, the 2.2-V-operation device with a gate width (W-g) of 2 mm exhibited a power-added efficiency (PAE) of 57.2% and an adjacent channel leakage power (P-adj) of -58 dBc at an output power of 21.3 dBm. The MESFET with the optimized direct ion implantation conditions and fabrication process achieved the highest PAE for PHS applications, The low-cost MMIC-oriented direct ion implantation technology has demonstrated the state-of-the-art results for new-generation PHS handsets for the first time.en_US
dc.language.isoen_USen_US
dc.titleHigh-efficiency and low-distortion directly-ion-implanted GaAs power MESFET's for digital personal handy-phone applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.622519en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume18en_US
dc.citation.issue9en_US
dc.citation.spage429en_US
dc.citation.epage431en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1997XR89300009-
dc.citation.woscount17-
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