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dc.contributor.authorLiao, C. C.en_US
dc.contributor.authorChin, Alberten_US
dc.contributor.authorSu, N. C.en_US
dc.contributor.authorLi, M. -F.en_US
dc.contributor.authorWang, S. J.en_US
dc.date.accessioned2014-12-08T15:05:01Z-
dc.date.available2014-12-08T15:05:01Z-
dc.date.issued2008en_US
dc.identifier.urihttp://hdl.handle.net/11536/3552-
dc.description.abstractWe report low V-t Al/TaN/[Ir3Si-HfSi2-x]/HfLaON CMOS using simple laser annealing/reflection with self-aligned and gate-first process compatible with current VLSI. At 1.05 nm EOT, good phi(ro-eff) of 5.04 and 4.24 eV, low V-t of -0.16 and 0.13 V, high mobility of 85 and 209 cm(2)/Vs, and small 85 degrees C BTI <= 40 mV (10 MV/cm, 1 hr) are measured for p- and n-MOS.en_US
dc.language.isoen_USen_US
dc.titleLow V-t gate-first Al/TaN/[Ir3Si-HfSi2-x]/HfLaON CMOS using simple laser annealing/reflectionen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2008 SYMPOSIUM ON VLSI TECHNOLOGYen_US
dc.citation.spage149en_US
dc.citation.epage150en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000259442500073-
Appears in Collections:Conferences Paper