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dc.contributor.authorHU, DCen_US
dc.contributor.authorCHEN, HCen_US
dc.date.accessioned2014-12-08T15:05:02Z-
dc.date.available2014-12-08T15:05:02Z-
dc.date.issued1992en_US
dc.identifier.issn0169-4243en_US
dc.identifier.urihttp://hdl.handle.net/11536/3559-
dc.identifier.urihttp://dx.doi.org/10.1163/156856192X00377en_US
dc.description.abstractA 90-degrees peel tester with substrate heating capability was built to evaluate the adhesion strength of polyimide films to a silicon substrate. The effects of polyimide film thickness and peel rate on polyimide adhesion to a silicon substrate under high or low humidity, and at elevated temperatures, have been evaluated. In a high humidity environment, a low peel strength was measured. The influence of moisture on the peel strength increases with decreasing peel rate. Peeling at elevated temperature reduces the moisture effect even under high humidity conditions. Using a low peel rate in a high humidity environment, the measured peel strength showed a maximum as the polyimide film thickness increased. No striations in peeled polyimide films were observed for peeling in a high humidity environment.en_US
dc.language.isoen_USen_US
dc.subjectADHESIONen_US
dc.subjectPEEL TESTen_US
dc.subjectPOLYIMIDEen_US
dc.subjectHUMIDITY EFFECTen_US
dc.subjectHIGH TEMPERATURE PEELINGen_US
dc.subjectTHIN FILM PACKAGINGen_US
dc.subjectAMINOSILANEen_US
dc.titleTEMPERATURE AND HUMIDITY EFFECTS ON ADHESION OF POLYIMIDE FILM TO A SILICON SUBSTRATEen_US
dc.typeArticleen_US
dc.identifier.doi10.1163/156856192X00377en_US
dc.identifier.journalJOURNAL OF ADHESION SCIENCE AND TECHNOLOGYen_US
dc.citation.volume6en_US
dc.citation.issue5en_US
dc.citation.spage527en_US
dc.citation.epage536en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:A1992HZ00500002-
dc.citation.woscount5-
Appears in Collections:Articles