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dc.contributor.authorDAI, CMen_US
dc.contributor.authorCHUU, DSen_US
dc.contributor.authorHSIEH, WFen_US
dc.date.accessioned2014-12-08T15:05:04Z-
dc.date.available2014-12-08T15:05:04Z-
dc.date.issued1991-12-16en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.105728en_US
dc.identifier.urihttp://hdl.handle.net/11536/3600-
dc.description.abstractA method, which utilizes interference enhanced Raman scattering and resonant Raman scattering techniques, is used to overcome the low efficiency of Raman methods to diagnose highly reflective materials. As applied to the p-type Si wafer, the enhanced gain is up to nearly a factor of 80 at 4880 angstrom excitation. Because of the strong absorption of the scattered light, it is recommended that the suitable deposited thickness of CdS films should not be thicker than 700 angstrom.en_US
dc.language.isoen_USen_US
dc.titleRAMAN INTENSITY ENHANCEMENT OF THE SI PEAK BY CDS THIN-FILMSen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.105728en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume59en_US
dc.citation.issue25en_US
dc.citation.spage3273en_US
dc.citation.epage3275en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:A1991GV07900024-
dc.citation.woscount6-
Appears in Collections:Articles