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dc.contributor.authorHSU, SLen_US
dc.contributor.authorLIU, LMen_US
dc.contributor.authorLIN, MSen_US
dc.contributor.authorCHANG, CYen_US
dc.date.accessioned2014-12-08T15:05:06Z-
dc.date.available2014-12-08T15:05:06Z-
dc.date.issued1991-11-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.119218en_US
dc.identifier.urihttp://hdl.handle.net/11536/3648-
dc.description.abstractThe increase of the "effective" gate oxide thickness for W-polycide processes is studied. The samples with as-deposited and annealed W polycide are analyzed by secondary ion mass spectrometry, transmission electron microscopy (TEM), and high-frequency CV measurements. The TEM cross section shows that the gate oxide thicknesses are approximately 244 and approximately 285 angstrom for as-deposited and 1000-degrees-C annealed samples, respectively. The TEM results agree with that from CV measurements. The TEM analyses provide a direct physical evidence of an additional oxide thickness (approximately 41 angstrom) during the W-polycide annealing.en_US
dc.language.isoen_USen_US
dc.titleDIRECT EVIDENCE OF GATE OXIDE THICKNESS INCREASE IN TUNGSTEN POLYCIDE PROCESSESen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.119218en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume12en_US
dc.citation.issue11en_US
dc.citation.spage623en_US
dc.citation.epage625en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1991GL47900015-
dc.citation.woscount21-
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