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dc.contributor.authorHsieh, CCen_US
dc.contributor.authorWu, CYen_US
dc.contributor.authorJih, FWen_US
dc.contributor.authorSun, TPen_US
dc.date.accessioned2014-12-08T15:01:32Z-
dc.date.available2014-12-08T15:01:32Z-
dc.date.issued1997-08-01en_US
dc.identifier.issn1051-8215en_US
dc.identifier.urihttp://dx.doi.org/10.1109/76.611171en_US
dc.identifier.urihttp://hdl.handle.net/11536/373-
dc.description.abstractA discussion of CMOS readout technologies fur infrared (IR) imaging systems is presented, First, the description of various types of IR detector materials and structures is given, The advances of detector fabrication technology and microelectronics process technology have led to the development of large format array of IR imaging detectors, For such large IR FPA's which is the critical component of the advanced infrared imaging system, general requirement and specifications are described, To support a good interface between FPA and downstream signal processing stage, both conventional and recently developed CMOS readout techniques are presented and discussed, Finally, future development directions including the smart focal plane concept are also introduced.en_US
dc.language.isoen_USen_US
dc.subjectdetectoren_US
dc.subjectfocal plane arrayen_US
dc.subjectinfrared imagingen_US
dc.subjectreadout circuiten_US
dc.subjectthermal imageen_US
dc.titleFocal-plane-arrays and CMOS readout techniques of infrared imaging systemsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/76.611171en_US
dc.identifier.journalIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGYen_US
dc.citation.volume7en_US
dc.citation.issue4en_US
dc.citation.spage594en_US
dc.citation.epage605en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1997XP52000006-
dc.citation.woscount76-
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