Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chang, Li-Chun | en_US |
dc.contributor.author | Lee, Dai-Ying | en_US |
dc.contributor.author | Ho, Chia-Cheng | en_US |
dc.contributor.author | Chiou, Bi-Shiou | en_US |
dc.date.accessioned | 2014-12-08T15:05:15Z | - |
dc.date.available | 2014-12-08T15:05:15Z | - |
dc.date.issued | 2007-12-03 | en_US |
dc.identifier.issn | 0040-6090 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/j.tsf.2007.07.009 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/3785 | - |
dc.description.abstract | CaCu3Ti4O12 (CCTO) thin films with various thicknesses were prepared by a sol-gel multiple coating processes on Pt/Ti/SiO2/Si substrates. Microstructures and surface morphologies of CCTO thin films were analyzed by grazing incident X-ray diffractometer (GIXRD) and scanning electron microscope (SEM), respectively. The correlation between the thickness and electrical properties of CCTO films was investigated. The dielectric constants of CCTO films decreased with increasing film thickness (coating cycle). Both the dielectric constant of CCTO films and interlayer are calculated. Possible mechanisms are explored to explain the thickness dependence of the dielectric constant of CCTO films. (C) 2007 Elsevier B.V. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | sol-gel | en_US |
dc.subject | CaCu3Ti4O12 (CCTO) | en_US |
dc.subject | thickness-dependent properties | en_US |
dc.subject | dielectric | en_US |
dc.title | Thickness-dependent microstructures and electrical properties of CaCu3Ti4O12 films derived from sol-gel process | en_US |
dc.type | Article; Proceedings Paper | en_US |
dc.identifier.doi | 10.1016/j.tsf.2007.07.009 | en_US |
dc.identifier.journal | THIN SOLID FILMS | en_US |
dc.citation.volume | 516 | en_US |
dc.citation.issue | 2-4 | en_US |
dc.citation.spage | 454 | en_US |
dc.citation.epage | 459 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Innovative Packaging Research Center | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.contributor.department | Innovative Packaging Research Center | en_US |
dc.identifier.wosnumber | WOS:000252037500066 | - |
Appears in Collections: | Conferences Paper |
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