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dc.contributor.authorCHUANG, HFen_US
dc.contributor.authorLEE, CPen_US
dc.contributor.authorWU, SCen_US
dc.date.accessioned2014-12-08T15:05:18Z-
dc.date.available2014-12-08T15:05:18Z-
dc.date.issued1991-03-01en_US
dc.identifier.issn0957-4522en_US
dc.identifier.urihttp://dx.doi.org/10.1007/BF00695001en_US
dc.identifier.urihttp://hdl.handle.net/11536/3848-
dc.description.abstractThe thermal stability of MoSi(x) Schottky contacts to GaAs has been studied. The contacts were analysed by Rutherford backscattering spectroscopy (RBS), X-ray diffraction (XRD), sheet resistance, and current-voltage measurements. We have studied MoSi(x) with the compositions x = 0, 0.3, 0.6, 1, and 2. The films were annealed at various temperatures up to 850-degrees-C. The thermal stability of the films is found to be x-dependent. The best composition for thermally stable Schottky contacts is Mo5Si3. Good Schottky characteristics were retained with annealing temperatures up to 850-degrees-C for 30 min.en_US
dc.language.isoen_USen_US
dc.titleMOLYBDENUM SILICIDE SCHOTTKY CONTACTS TO GAASen_US
dc.typeArticleen_US
dc.identifier.doi10.1007/BF00695001en_US
dc.identifier.journalJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSen_US
dc.citation.volume2en_US
dc.citation.issue1en_US
dc.citation.spage28en_US
dc.citation.epage33en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:A1991FB09200008-
dc.citation.woscount0-
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