THROUGHPUT PERFORMANCE OF MULTISTAGE INTERCONNECTION NETWORKS IN PRESENCE OF MULTIPLE MEMORY HOT SPOTS

Full metadata record

DC Field	Value	Language
dc.contributor.author	LEE, TH	en_US
dc.date.accessioned	2014-12-08T15:05:35Z	-
dc.date.available	2014-12-08T15:05:35Z	-
dc.date.issued	1990-04-12	en_US
dc.identifier.issn	0013-5194	en_US
dc.identifier.uri	http://hdl.handle.net/11536/4128	-
dc.language.iso	en_US	en_US
dc.title	THROUGHPUT PERFORMANCE OF MULTISTAGE INTERCONNECTION NETWORKS IN PRESENCE OF MULTIPLE MEMORY HOT SPOTS	en_US
dc.type	Article	en_US
dc.identifier.journal	ELECTRONICS LETTERS	en_US
dc.citation.volume	26	en_US
dc.citation.issue	8	en_US
dc.citation.spage	536	en_US
dc.citation.epage	537	en_US
dc.contributor.department	交大名義發表	zh_TW
dc.contributor.department	電信工程研究所	zh_TW
dc.contributor.department	National Chiao Tung University	en_US
dc.contributor.department	Institute of Communications Engineering	en_US
dc.identifier.wosnumber	WOS:A1990DB40700026	-
dc.citation.woscount	1	-
Appears in Collections:	Articles

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