THROUGHPUT PERFORMANCE OF MULTISTAGE INTERCONNECTION NETWORKS IN PRESENCE OF MULTIPLE MEMORY HOT SPOTS

Title:	THROUGHPUT PERFORMANCE OF MULTISTAGE INTERCONNECTION NETWORKS IN PRESENCE OF MULTIPLE MEMORY HOT SPOTS
Authors:	LEE, TH 交大名義發表電信工程研究所 National Chiao Tung University Institute of Communications Engineering
Issue Date:	12-Apr-1990
URI:	http://hdl.handle.net/11536/4128
ISSN:	0013-5194
Journal:	ELECTRONICS LETTERS
Volume:	26
Issue:	8
Begin Page:	536
End Page:	537
Appears in Collections:	Articles

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