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dc.contributor.author劉安祐en_US
dc.contributor.authorLiu, An-Yuen_US
dc.contributor.author周長彬en_US
dc.contributor.authorChou, Chang-Pingen_US
dc.date.accessioned2014-12-12T01:28:27Z-
dc.date.available2014-12-12T01:28:27Z-
dc.date.issued2008en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT079614528en_US
dc.identifier.urihttp://hdl.handle.net/11536/42095-
dc.description.abstract雙極板佔了燃料電池組中90%的體積,是影響電池電傳導速率和製作成本的重要因素。相對於傳統以金屬、石墨及碳複材所研製雙極板之問題,本研究以PMMA為基板並濺鍍上不同金屬薄膜提供金屬表面,使非導體金屬化流程所製備之雙極板達到具有導電之特性。 本文利用非導體金屬化製程來製備雙極板,首先PMMA板表面經過機械粗化改質,再濺鍍上不同金屬薄膜 (包括Ti、Cr、Zr、Cu),並探討不同金屬薄膜於PMMA表面附著力之影響,以及此四種金屬薄膜之電性、物性及化學性性能試驗比較。 四種金屬薄膜在其性能比較後,以PMMA濺鍍上Cu薄膜性能較佳,此製程結果可提供一層具導電層表面,使未來進行化學電鍍增厚時可以有效的進行導電膜沉積,並提供良好的鍍膜附著性於流道切削過程中避免鍍膜剝離狀態。zh_TW
dc.description.abstractThe bipolar plate has occupied 90% volumes in the fuel cell stacks and affects the fuel cell’s conductivity and manufacturing cost. The traditional bipolar plate materials include metal、graphite and carbon composite material have several problems. This research used PMMA as the foundation plate and different types of metallic film were deposited by sputtering. Non-conductor metallization technique was used prepare the bipolar plate. The physical properties of the PMMA board surface could be changed by the machinery roughen treatment, then the board was coated via sputtering method with different metallic film (Ti、Cr、Zr、Cu),and finally discusses influence in the PMMA surface the adhesion、electrical properties、physical and chemical properties of the PMMA with the different metallic films were tested and discussed. From the results of performance test, it was shown that the Cu film is better than others. This study results also showed that this pre-coated copper film can provide good conductivity and future process of electroplating.en_US
dc.language.isozh_TWen_US
dc.subject燃料電池zh_TW
dc.subject雙極板zh_TW
dc.subjectFuel Cellsen_US
dc.subjectBipolar Plateen_US
dc.title不同表面濺鍍對於複合雙極板之導電性及機械強度研究zh_TW
dc.titleThe Study of Electrical Conductivity and Mechanical Strength on Bipolar Plate via Different Surfaceen_US
dc.typeThesisen_US
dc.contributor.department機械工程學系zh_TW
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