系統級封裝於無線行動通訊產業競爭策略之研究- 以Q公司為例 -

Abstract

隨著新興網路通訊技術，無線、行動、寬頻等應用技術的融合創新，而延伸發展出多種新興的無線網路通訊應用技術如WLAN、3G、WiMAX、LTE和4G，直接、間接促使無縫隙無線網路通訊環境逐步成形。在個人行動裝置、通信設備、數位家庭娛樂及汽車電子等市場需求，不斷成長的趨勢下，對於無線通訊產業有正面激勵效果，預期未來對無線通訊產品需求有高成長的可能性。 另一方面隨著無線通訊產品功能多樣化與半導體摩爾定律不斷向前推進，半導體晶圓製程技術不斷地微小化，晶片內含的邏輯閘數目急速上升，伴隨而來的就是傳輸時脈上升以及信號接腳數目變多。為了要將不同製程的IC元件或電子元件整合，藉由縮小產品體積、縮短開發時程及降低電磁干擾，以提昇產品整合度與可靠度，結合大量生產來降低成本，於是『系統級封裝產業』也逐漸形成。 本論文專注於探討與分析無線行動通訊產業概況及系統級封裝產業的特性與概況，並透過文獻的探討，了解競爭策略分析的理論基礎。再以個案研究法，並搭配企業經營 SWOT分析，分析個案公司從事系統級封裝模組研發的公司內部之優勢、劣勢及公司外部之機會與威脅，制定競爭策略的準則。最後再擬定其可行性發展策略，作出結論及建議供業界及學術界參考。

The integration and innovation of new network communication technology and the wireless/mobile/broadband applications have triggered the development of many new application technologies of wireless communications, such as WLAN, 3G, WiMAX, LTE and 4G, which will enable the setup of a seamless wireless communication environment directly and indirectly. The development trend of wireless communication industry is very positive due to the increasing demand of personal mobile devices, communication equipments, digital home entertainment and car electronics. Accordingly, the market for wireless products is expected to have high growth rate in the future. On the other hand, the features of the wireless product are getting more complex; the development of semiconductor technology always follows the Moore’s law; the process technology of wafer reduces the IC size continually; and the number of logic gate in chips increases very quickly. Consequently, it causes higher clock timing of transmission and more number of signal pin-out. Thus, the industry of the SiP (System in Package) is developed gradually, in order to integrate different types of IC and components; reduce product size, EMI, cost and development schedule; and improve integration and reliability. This thesis focuses on the study and analysis of the industry profile of wireless mobile communication and the characteristics of system in package. The related developments of SiP and the theory of competitive strategy are studied and discussed. Through the case study and SWOT analysis for developing SiP modules, this thesis analyzes the strengths, weakness, opportunities and threats of the Q company and further establishes the rule of the competitive strategy. Finally, a practical development strategy for SiP is suggested.