| 标题: | WETTABILITY IN ZRO2-NI AND ZRO2-CU BONDING |
| 作者: | DUH, JG CHIEN, WS CHIOU, BS 电控工程研究所 Institute of Electrical and Control Engineering |
| 公开日期: | 1-四月-1989 |
| URI: | http://hdl.handle.net/11536/4381 |
| ISSN: | 0261-8028 |
| 期刊: | JOURNAL OF MATERIALS SCIENCE LETTERS |
| Volume: | 8 |
| Issue: | 4 |
| 起始页: | 405 |
| 结束页: | 408 |
| 显示于类别： | Articles |
- 硬焊合金对矽晶片和钻石膜之润湿性研究 / 王怡明;Wang, Yi-Ming;郭正次;Cheng-Tzu Kuo
- 利用银铜基焊料接合氧化锆与纯钛之强度测试与其机械性质 / 丘仲民;Chiu, Chung-Min;林健正;Lin, Chien-Cheng
- Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO2 joint using an Ag68.8Cu26.7Ti4.5 interlayer at 900 degrees C / Wei, Shen-Hung;Lin, Chien-Cheng
- 氧化锆接合金属高温反应机构及其微观分析 / 魏伸纮;Wei, Shen-Hung;林健正;Lin, Chien-Cheng
- 不同组成CeO2/ZrO2复合材料与钛金属高温扩散反应 / 彭翊玮;林健正
- Wettability of electroless Ni in the under bump metallurgy with lead free solder / Young, BL;Duh, JG;Chiou, BS
Loading...