300mm晶圓清洗槽槽體內部流場之數值模擬

Abstract

2006年積體電路產業在台灣達到單一兆元產業，每年的設備與零組件需求逾2,500億元，卻絕大多數都是外商天下，原因不外乎國內廠商不注重設備研發。而本研究的主要目的探討12吋晶圓蝕刻清洗槽內部整體的流場變化，模擬不同蝕刻清洗槽入水管位置及不同出水孔位置角度的流場改變的情形，以作為昂貴石英清洗槽的設計開發參考依據，本文的計算方法是應用數值模擬分析軟體STAR-CD模擬蝕刻清洗槽內部流場情況。本研究得到最佳流場結果為2個內徑16mm入水管，對稱槽中央距離為320mm，每支入水管有2排各68個孔徑1mm的出水孔，其出水孔方向角度為向槽中央水平仰角17°及64°。

The IC industry of Taiwan reached one trillion dollars in 2006. The annual demand for equipments and spare parts are more than 250 billion, but it was mostly contributed by the foreign suppliers. The reason is the domestic suppliers didn’t focus on research and development of the related equipments. The main purpose of this study is to explore the overall flow field variation of the 12-inch wafers in the etching and cleaning tanks and to simulate the inlet pipe positions and angles in the different etching and cleaning tanks. And then, we can design and develop the expansive quartz tanks according to the simulation results. In the research, the calculation is to apply the numerical simulation analysis software STAR-CD to simulate the flow field condition in the etching and cleaning tank. Finally, our conclusion is each inlet pipe has two rows of 68 outlet holes of 1mm diameter and its angle to the direction of the water tank hole the central level elevation 17 ° and 64 °.