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dc.contributor.author張志成en_US
dc.contributor.authorCheng, Jhang-Jhihen_US
dc.contributor.author成維華en_US
dc.contributor.authorChieng, Wei-Huaen_US
dc.date.accessioned2014-12-12T01:39:00Z-
dc.date.available2014-12-12T01:39:00Z-
dc.date.issued2009en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT079714609en_US
dc.identifier.urihttp://hdl.handle.net/11536/44764-
dc.description.abstract覆晶技術越來越廣泛使用在晶片接合的製程上面，製程的好壞更是取決於其機構的設計。本論文提出了以自我對準機構，力量控制機構，微步進機機構去取代原有的覆晶機台的氣壓鋼及導螺桿，以改善其力量控制及平面定位的部份，並利用WINPC32及RTX即時作業系統去整合覆晶機台，使得晶片不會因為過大的壓力而壞掉，提高其製程的良率。zh_TW
dc.description.abstractFlip chip technology widely used in bonding process, and the bonding process which is good or not depends on its mechanism design. This paper uses the self-aligned mechanism, the force control mechanism, micro-stepping mechanism to replace the pneumatic cylinder and lead screw on the existing flip chip machine. And use WINPC32 and the RTX real-time operating system to integrate the flip chip machine. Then the chip will not be pressured too much and broken, improve the process yield rate.en_US
dc.language.isoen_USen_US
dc.subject覆晶機台zh_TW
dc.subjectWINPC32zh_TW
dc.subjectRTXzh_TW
dc.subjectFlip chip machineen_US
dc.subjectWINPC32en_US
dc.subjectRTXen_US
dc.title覆晶多晶片模組構裝設備開發zh_TW
dc.titleFlip Chip Based MCM Packaging Equipment Developmenten_US
dc.typeThesisen_US
dc.contributor.department機械工程學系zh_TW
顯示於類別：畢業論文


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