THE EFFECTS OF THERMAL NITRIDATION CONDITIONS ON THE RELIABILITY OF THIN NITRIDED OXIDE-FILMS

Full metadata record

DC Field	Value	Language
dc.contributor.author	TSAI, HH	en_US
dc.contributor.author	WU, LC	en_US
dc.contributor.author	WU, CY	en_US
dc.contributor.author	HU, CM	en_US
dc.date.accessioned	2014-12-08T15:06:05Z	-
dc.date.available	2014-12-08T15:06:05Z	-
dc.date.issued	1987-04-01	en_US
dc.identifier.issn	0741-3106	en_US
dc.identifier.uri	http://hdl.handle.net/11536/4649	-
dc.language.iso	en_US	en_US
dc.title	THE EFFECTS OF THERMAL NITRIDATION CONDITIONS ON THE RELIABILITY OF THIN NITRIDED OXIDE-FILMS	en_US
dc.type	Article	en_US
dc.identifier.journal	IEEE ELECTRON DEVICE LETTERS	en_US
dc.citation.volume	8	en_US
dc.citation.issue	4	en_US
dc.citation.spage	143	en_US
dc.citation.epage	145	en_US
dc.contributor.department	工學院	zh_TW
dc.contributor.department	College of Engineering	en_US
dc.identifier.wosnumber	WOS:A1987G609400006	-
dc.citation.woscount	25	-
Appears in Collections:	Articles

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