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dc.contributor.authorChang, Tien-Lien_US
dc.contributor.authorLee, Ya-Weien_US
dc.contributor.authorChen, Chun-Chien_US
dc.contributor.authorKo, Fu-Hsiangen_US
dc.date.accessioned2014-12-08T15:06:05Z-
dc.date.available2014-12-08T15:06:05Z-
dc.date.issued2007-05-01en_US
dc.identifier.issn0167-9317en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.mee.2007.01.266en_US
dc.identifier.urihttp://hdl.handle.net/11536/4652-
dc.description.abstractAn experimental study for identifying DNA strands immobilized in the different particle sizes of gold nanoparticle (AuNP) between nanogap electrodes is presented. The nanogap-based electrics chip demonstrates a significant electrical property with a target DNA (DNA) concentration of 10 pM in the different particle sizes of AuNP to be analyzed in order to make the assay useful for an integrated lab-on-a-chip application system. The biochips with nanogap electrodes are fabricated by e-beam lithography (EBL). Different from traditional detection methods including polymerase chain reaction (PCR) based on assays which are expensive and time consuming for DNA strands research. By the method of electrical characterization, a change in measured current through the different particle sizes of AuNP can pave the way for further use in sensitive biomolecule detection study. (c) 2007 Published by Elsevier B.V.en_US
dc.language.isoen_USen_US
dc.subjectelectrical detectionen_US
dc.subjectDNA chipen_US
dc.subjectgold nanoparticlesen_US
dc.subjectparticle sizeen_US
dc.subjectself-assemblyen_US
dc.titleEffect of different gold nanoparticle sizes to build an electrical detection DNA between nanogap electrodesen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.mee.2007.01.266en_US
dc.identifier.journalMICROELECTRONIC ENGINEERINGen_US
dc.citation.volume84en_US
dc.citation.issue5-8en_US
dc.citation.spage1698en_US
dc.citation.epage1701en_US
dc.contributor.department材料科學與工程學系奈米科技碩博班zh_TW
dc.contributor.departmentGraduate Program of Nanotechnology , Department of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000247182500238-
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